CHALLENGE
Challenge
AI-era computing requires device materials and architectures that operate reliably under extreme thermal and energy constraints.
Advanced Semiconductor Materials and Devices for AI age | C…
IMMS Core Projects (CP1–CP4) are cross-cutting research programs that integrate efforts across Technical Groups and shared Platforms to achieve breakthrough ou…
Non-epitaxial materials for zero-heat photonics and extreme-temperature (50mK–300°C) devices.
Non-epitaxial materials for zero-heat photonics and extreme-temperature (50mK–300°C) devices.
CHALLENGE
AI-era computing requires device materials and architectures that operate reliably under extreme thermal and energy constraints.
RESEARCH GOAL
Develop advanced semiconductor materials and devices for heat-aware, high-performance AI infrastructure.
RESEARCH PROGRAM
<p>As AI-driven demand surges and thermal management becomes vital, CP1 develops non-epitaxial materials for zero-heat photonics and extreme-temperature (50mK–300°C) devices. CP1 develops information processing devices that maintain stable operation from ultra-cryogenic 50mK to high-heat 300°C environments, and concentrates on non-epitaxial material technologies that are key to realizing heat-free photonic devices.
High-Performance Extreme-Temperature Devices (50mK to 300°C): developing information processing devices that maintain flawless operational stability across a vast thermal spectrum, ensuring resilient performance for next-generation AI infrastructure and specialized electronics operating in harsh conditions.
TG COLLABORATION
PLATFORMS
EXPECTED OUTCOMES
Extreme-temperature device concepts, zero-heat photonics pathways, and validated semiconductor material strategies.